Will SMIC be further restricted? Qualcomm’s 5G mobile phone chip shipments may be affected, and MediaTek is an accidental beneficiary?

Will SMIC be further restricted? Qualcomm’s 5G mobile phone chip shipments may be affected, and MediaTek is an accidental beneficiary?  

According to foreign media reports, the United States will expand trade sanctions against China in the near future, including the possibility of blacklisting the Chinese wafer foundry SMIC. According to the analysis of the semiconductor industry, if this happens, the shipments of IC design factories such as Qualcomm and Broadcom, which have placed a large number of orders in SMIC, will be severely impacted. On the contrary, Taiwan wafer foundries and NOR Flash factories will welcome more orders from customers. However, due to the overall tight production capacity of Taiwan’s wafer foundries in 2021, the orders that can be undertaken are relatively limited.

According to the data, SMIC has 8-inch factories in Shanghai, Tianjin, Shenzhen and other places with a total monthly production capacity of 385,000 pieces, mainly producing 0.35 micron to 90 nanometer process. In addition, SMIC also has 12-inch factories in Shanghai and Beijing, with a total monthly production capacity of 195,000 pieces. Among them, the main process of the two 12-inch factories in Beijing is between 0.18 micron and 24 nanometers, and the Shanghai 12-inch factory provides 14 nanometer fins. Type field effect transistor (FinFET) advanced process.

At the end of September this year, SMIC issued an announcement confirming that the U.S. Department of Commerce had sent a letter to its suppliers stating that all U.S. equipment, accessories, and raw materials exported to SMIC are subject to export control regulations, and they must obtain permission from the U.S. competent authority. Shipment. Although SMIC has always clarified that it does not involve military chips, the attitude of the United States may remain tough after the election. Foreign media reported that the United States may blacklist SMIC. In addition to restrictions on equipment and material procurement, non-Chinese customers It is also inevitable to transfer orders to Taiwan or South Korea.

SMIC’s top two overseas customers, Qualcomm and Broadcom, mainly produce power management ICs with a 0.18-micron process in an 8-inch plant. Some 28nm RF components are also entrusted to SMIC. Due to U.S. export control restrictions and the threat of possible blacklists, Qualcomm and Broadcom have successively proposed to increase wafer production to Taiwanese foundries such as TSMC, UMC, World Advanced, and PSMC for supply chain security. volume requirements. Among them, TSMC has benefited from the transfer order effect of Qualcomm and Broadcom. The 28-nanometer production capacity will be fully loaded in the first half of next year, and the 8-inch plant will be full until the second half of next year.

According to industry analysis, Qualcomm orders at least 600,000 power management IC wafers from SMIC every year, accounting for almost 40% of Qualcomm’s own supply. The supply of equipment and chemical materials will be cut off, SMIC may find it difficult to maintain normal operation, and Qualcomm will immediately lose a large supply of power management ICs. In fact, after entering the 5G generation, the usage of radio frequency devices and antenna modules in mobile phones has increased significantly, and the usage of supporting power management ICs has also increased significantly, which also makes mobile phone chip manufacturers such as Qualcomm need more power management IC production capacity .

Power management ICs are mostly produced on 8-inch wafers due to process issues. Although Qualcomm has transferred orders to Taiwan-based fabs, there is currently a serious shortage of 8-inch wafer foundries regardless of TSMC, UMC, and the world. It can be seen that the order volume is significantly greater than the production capacity by 30-40%. Even if the price is increased, it may be difficult to arrange the production capacity in the first half of 2021. Even if Qualcomm successfully obtains the production capacity of Taiwan’s three major wafer foundries, they can supply Qualcomm’s 8-inch production capacity. will also be very limited.

The industry expects that if SMIC is included in the U.S. trade blacklist, it will lead to an increase in the effect of order transfer. Next year, the production capacity of 8-inch wafer foundry will be tight throughout the year. It is expected that the price of foundry will continue to rise, including panel driver IC, Power management ICs, power semiconductors, etc. will also continue to be in short supply and prices will rise due to insufficient foundry capacity.

In this context, if SMIC is blacklisted, Qualcomm’s power management ICs will have a long-term and serious shortage problem, which is bound to directly affect the shipment of its 5G mobile phone chips (Qualcomm’s power management ICs Chips that belong to mobile phone chips), Qualcomm’s mobile phone chip market share will decline. In contrast, MediaTek has previously reported that it has obtained a large amount of 12-inch power management IC wafer production capacity from PSMC, which is expected to grab more of Qualcomm’s 5G mobile phone chip market, and the annual 5G mobile phone chip shipments are expected to Multiplied growth.

In addition, if SMIC is blacklisted, the NOR Flash used by GigaDevice for Apple’s AirPods will also be manufactured in SMIC with a 65/55nm process. The market expects that GigaDevice’s orders will be transferred to Winbond and Macronix.

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Microsoft warns: TodayZoo phishing tool is widely used in certificate-stealing attacks

The Microsoft 365 Defender team disclosed a large-scale certificate-stealing phishing campaign last week, and called for vigilance against “TodayZoo”, a phishing tool that stitches different tool codes into a custom suite to steal user login information.

At the end of last year, the Microsoft team detected the “TodayZoo” phishing campaign. Attackers pretended to be Microsoft and sent emails, claiming to reset passwords or fax and scanner notifications, redirecting victims to certificate theft pages to commit crimes.

Specifically, TodayZoo’s attack method is similar to another tool called DanceVida, which is to imitate and confuse relevant components that overlap with Botssoft, FLCFood, Office-RD117, WikiRed, and Zenfo, but TodayZoo uses its own The filter logic of replaces the original function of the certificate collection component.

According to Microsoft researchers, TodayZoo is widely used because of the large number of phishing tools available for sale or rent, making it easy for lone wolf attackers to pick the best features and combine them into a custom suite trying to make a profit for themselves.

These kits can be sold through openly scam sellers, or they may be repurposed and repackaged by resellers. On the dark web, archives containing images, scripts, and HTML pages are usually sold as one-off payments so that attackers can set up phishing emails and pages, use them as lures, and collect and transmit credentials to attacker-controlled server.

According to Microsoft observations: Most of the phishing tools available today are derived from existing tool clusters, and due to the large amount of code sharing between phishing tools, this trend will continue to become a norm.

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Infineon and China Automotive Center Automotive Engineering Research Institute jointly release test case library for automotive control chip functional safety software

[February 1, 2021, Shanghai, China]Infineon Technologies and China Automotive Research Institute (Tianjin) Automotive Engineering Research Institute Co., Ltd. (“Engineering Institute”) jointly released the Infineon AurixTM microcontroller based on a virtualization platform today. Device functional safety test platform. The platform will help OEMs and auto parts suppliers to complete software testing and verification of automotive functional safety designs more efficiently and at lower cost.

With the rapid development of vehicle electrification, intelligence, and networking, while the number of Electronic control units (ECUs) in the vehicle continues to increase, the functional safety level has become the core evaluation index of key ECUs. The on-board control chip (MCU) is the brain of the ECU, and its software design is crucial to the realization of system functional safety. The functional safety test case library jointly developed by Infineon and the Academy of Engineering uses the Synopsys Virtualization Development Kit (Synopsys VDK) to perform fault simulation injection into the chip behavior-level model through software. Compared with the traditional real fault construction method for hardware, the software method will greatly improve the test coverage, efficiency and flexibility, reduce the overall cost of MCU functional safety software testing and verification, and provide OEMs and component manufacturers with MCU functional safety. Software testing and verification provides a new methodology.

Infineon’s Aurix series is the world’s first MCU that complies with the ISO 26262:2018 version of the ASIL-D functional safety standard. So far, more than 50 car brands have adopted this series of products, which are very suitable for universal functional safety design. And test and verify the hardware foundation of the software.

Cao Yanfei, Senior Vice President of Infineon Technologies Greater China and Head of Automotive Electronics Business Unit, said: “As the world’s largest supplier of automotive semiconductors, Infineon continues to work hard in the field of automotive system security. Industrialization of local design. The cooperation between us and the Automotive Engineering Research Institute of China Automotive Industry Corporation will boost the development and testing technology of vehicle chip functional safety into the stage of large-scale application, and escort the future intelligent travel.”

Mr. Gao Jidong, Dean of the Academy of Engineering, said: “The Automotive Engineering Research Institute of the China Automobile Center actively explores automotive safety technology, adheres to the automotive industry chain, realizes high-end R&D supply through continuous technological innovation, and strives to create a ‘high-end systemization, innovation internationalization, and platform ecology. ‘Infineon’s industry R&D platform to build a world-class automotive engineering technology service enterprise with global competitiveness. At the same time, we look forward to cooperating with Infineon, a global automotive chip leader, to strengthen the implementation of the functional safety business of microcontroller chips. “

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How to quickly design an infrared body temperature detector? TI is here to help!

Body temperature detection is a necessary monitoring for us at home, in and out of the community or workplace, and when we travel. Infrared temperature detectors help reduce contact infection through non-contact temperature measurement. Here we come to talk to you about this system and the main design scheme.

Body temperature detection is a necessary monitoring for us at home, in and out of the community or workplace, and when we travel. Infrared temperature detectors help reduce contact infection through non-contact temperature measurement. Here we come to talk to you about this system and the main design scheme.

The MSP430 series microcontroller is a 16-bit ultra-low power consumption RISC mixed-signal processor introduced to the market by Texas Instruments (TI) in 1996. There are countless applications developed based on this series of products, especially for sensing And detection terminal applications, because of the high-performance ADC, LCD driver, serial communication, PWM output and other modules integrated on the chip, it has become the best choice for infrared body temperature detector manufacturers. With the rich online software and hardware design resources provided by TI, developers can greatly simplify the design process, quickly develop prototypes of infrared body temperature detectors, and save circuit board space to reduce costs.

The figure below provides an infrared temperature detector system solution based on MSP430 microcontroller and TI power management, amplifier and temperature sensor devices.

Figure 1 System block diagram of infrared body temperature detector

As the main control MCU of the solution, MSP430 series single-chip microcomputer can provide the following functions and features for the design of the thermometer system:

Rich peripherals meet the design requirements of thermometers:

1. The successive approximation SAR ADC or high-resolution Sigma-Delta ADC integrated on the MSP430 chip cooperates with TI’s TLV333 amplifier to sample the high-precision signal quantity collected by the analog infrared temperature sensor and convert the digital temperature quantity, and can also measure the battery voltage. conduct real-time monitoring;

2. The LCD driver module integrated on the MSP430 chip can help developers to quickly realize the design of LCD Display for the thermometer. The built-in LCD driver module of MSP430FR4133 up to 4×36 segments or 8×32 segments supports flexible configuration of LCD Segment and COM pins, which can simplify the developer’s PCB design;

3. The I2C serial communication interface can meet the signal acquisition and input of high-precision digital temperature sensor or digital infrared temperature sensor, digital proximity sensor and other auxiliary sensing elements;

4. The timer module integrated on the chip can output multiple PWM signals to drive the thermometer indicator light, buzzer and other devices;

5. GPIO interrupt enable in ultra-low power mode can provide fast button response in standby mode for battery-powered thermometer system.

The ultra-low power consumption design helps the thermometer’s long battery life and high frequency of use:

Since its launch in 1996, the MSP430 series of microcontrollers has always taken ultra-low power consumption as the family gene of the product, providing a wealth of low-power intelligent peripherals for the low-power design of the product. Due to the high frequency of use, the infrared body temperature detector has high requirements on the battery-powered battery life and the frequency of use, so the low-power operation of the thermometer has become a key challenge in system design.

A rich product family provides flexible memory options:

MSP430 series microcontrollers provide more than 16KB of on-chip memory, which can meet the memory requirements of most thermometer products. The rich product family of this series also provides a variety of memory options up to 512KB. Users can choose different memory sizes and quickly migrate existing designs without excessive workload. Recommended product models for thermometers are:

Part Number

Non-volatile Memory







10-bit SAR

4 x 36 or 8 x 32 segments






10-bit SAR





16-32KB Flash

16-bit Sigma-Delta

4 x 14 segments




16-32KB Flash

24-bit Sigma-Delta





64KB Flash

24-bit Sigma-Delta

320 segments



Table 1 Recommended models of infrared thermometer MCU products

The scheme in Figure 1 also includes TI’s extensive power management, signal chain and sensor products.

TPS61099 series chips are boost chips specially designed for applications requiring ultra-low power consumption. First of all, the static power consumption is only 800nA, and the input voltage is as low as 0.7V, which can perfectly support single-cell dry battery power supply. At the same time, when the input is 1.5V, the output is 3.3 The efficiency of 80% can be achieved under the condition of V/10uA. The TPS61099x series chips provide two kinds of output adjustable version and output fixed version for customers to choose. The fixed version supports almost various common output voltages from 1.8V to 5.0V.

The TPS62170 buck converter provides low IQ, which helps extend the battery life of the system, especially when the system is not in use. In addition, it supports high efficiency at switching frequencies above 2 MHz to help designers reduce the size of the inductors required, thereby reducing the size of the overall solution.

The TLV333 op amp is TI’s zero temperature drift op amp series, featuring high precision and low power consumption. On the one hand, the op amp’s ultra-low input offset voltage (15 µV max) and low temperature drift (0.02 µV/°C help minimize temperature sensing errors, and its rail-to-rail input/output performance helps maximize dynamic range. On the other hand, Low quiescent current (28 µA max), low voltage (1.8V to 5.5V) and small package size (minimum SC70 package), plus -40°C to +125°C operating temperature range, ideal for handheld or battery powered Medical equipment. In addition, the op amp series is also available in dual channel (TLV2333) and quad channel (TLV4333).

Faster settling times and lower noise may be required in some systems to help speed up temperature measurements. For these cases, OPA388 is a good alternative to TLV333. The OPA388 will provide lower input offset voltage (5µV max), lower noise (7 nV/rt(Hz)) and faster settling time (2µs), all of which will help minimize settling time and the required number of averaged samples to achieve the specified temperature resolution.

TI has a variety of op amps that can be used to interface signals between analog sensing elements and ADCs. The table below lists other amplifiers that can be used for this design, all in dual packages.

TI part number







Gain bandwidth (MHz)







VOS max at 25°/C (mV)







Drift (µV/°C)







IQ (mA)















Small outline integrated circuit (SOIC)/small outline transistor (SOT)-23






Table 2 Recommended operational amplifiers for signal interface

TI offers a variety of temperature sensors, our high precision digital sensor TMP117x has an accuracy of ±0.1°C over the -20°C to 50°C range. The device integrates a 16-bit resolution ADC that communicates with the designer’s digital controller via I2C or SMBus. The device is designed for battery powered systems as it has only 150nA Iq consumption in shutdown and requires only 3.5µA per 1Hz conversion cycle. For systems with an integrated ADC in the MCU, TI also offers analog temperature sensors and thermistors. The LMT70 provides a voltage output that corresponds to temperature with a maximum accuracy of ±0.13°C between 20°C and 42°C. For cost-sensitive systems, the TMP61 linear thermistor provides 1% temperature tolerance and simplifies the calibration process using traditional NTCs. For more cost-sensitive digital temperature sensing applications, TI’s TMP1075 can be used, which has ±1°C (max) accuracy over the −25°C to +100°C range. For systems that integrate an ADC in an MCU, TI also offers analog temperature sensors, and the TMP23x offers extensive design flexibility as designers can choose from ±0.5°C to ±6°C in accuracy and gain.

A low noise, sensitive voltage rail is usually required for powering the ADC and sensing elements. Low dropout regulators (LDOs) are a common choice for their ease of use and their ability to provide clean, low noise power to sensitive analog power rails. For this specific need, the TPS7A20’s ultra-low noise (6 µVRMS), high ripple rejection (85db @ 1 kHz), and low quiescent current (6 µA typical, 150nA in shutdown) make it the best choice . This provides the required low noise rails for the ADC and sensing elements (with little inherent output noise while filtering DC/DC ripple), while also providing low quiescent current for battery powered applications (extended battery life). For battery power systems, the TPS7A02 is another good choice, as it provides nanowatt-level IQ (25nA, 3nA in shutdown) while also providing high PSRR for post-DC/DC regulation. The TPS7A02 also has excellent transient response, which is critical for duty cycle loads.

There are some high-end products on the market that also include Bluetooth Low Energy (BLE) communication modules. If you are interested in adding it to your system, the CC2640R2F IC or CC2650MODA module is a great fit. TI’s SimpleLink™ software can help designers complete the development process as quickly as possible.

To reduce current consumption, load switches with integrated faults such as TPS2051x, or TPS22916xx with ultra-low leakage current, can also be used to disconnect the BLE module from battery power or any other DC power source. This extends the battery life of the product while adding other features to the user.

The TI devices detailed in this article will help designers quickly design infrared thermometers. TI values ​​the customer’s work to design and manufacture this end device with the support of our global manufacturing sites, while continuing to provide high-quality design assistance and excellent customer support.

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Qualcomm and Zhanrui chips jointly launched 5G chip commercialization and entered the “Warring States Era”

Although this year’s MWC communication conference was canceled, the rhythm of the 5G chips of the technology giants is still as usual, but the form of an online conference is selected. 5G in 2020 has attracted much attention, because the industry generally believes that this will be a key point in the scale of construction and the rise of the 5G market.

Under the current epidemic situation, the 5G chip market is still hot, and new products have been released frequently in the past two weeks. On February 26, UNISOC released its next-generation 5G SoC chip, the Tiger Ben T7520. On the same day, Qualcomm released the Snapdragon XR2 platform and 8cx 5G chipset. On February 18, Qualcomm also released the third-generation 5G modem and RF system, the Snapdragon X60.

Yao Jiayang, an analyst at TrendForce, told the 21st Century Business Herald reporter: “In terms of 5G SoC performance, it can be divided into several levels: the processing performance of the CPU itself for applications, AI computing power, and the built-in 5G Modem (modem). These three parts will be the focus of competition among major manufacturers. Broadly speaking, comparing 5G SoC with 4G SoC, the performance of these three parts has been significantly improved. In 2020, major manufacturers will in principle It will also be strengthened with the performance of these three aspects.”

At the same time as the performance improvement, various companies have also accelerated the speed of commercial use of 5G chips. Qualcomm, Huawei, UNISOC, Samsung, and MediaTek 5G chips have all been commercialized on mobile phones.

A new round of 5G chip competition

At present, the companies that have launched 5G baseband chips for mobile phones are Huawei, Qualcomm, Samsung, MediaTek and Ziguang Zhanrui. In addition to Qualcomm, the other four have launched 5G SoC chips with integrated baseband chips.

Among them, 5G baseband chips include Qualcomm’s Snapdragon X50, Snapdragon X55, and the newly released X60; Huawei’s Balong5G01, Balong5000; UNISOC’s Ivy V510, MediaTek’s Helio M70, Exynos Modem 5100, etc.

The released 5G SoC chips mainly include Huawei Kirin 990; Samsung Exynos 980, Exynos 990; MediaTek Dimensity 1000, Dimensity 800; UNISOC T7520, T7510.

The latest products are Qualcomm’s X60 and UNISOC’s Tiger Ben T7520.

Ziguang Zhanrui said that the Tiger Ben T7520 is the second-generation 5G smartphone platform of Ziguang Zhanrui. It adopts the 6nm EUV process technology. While the performance is improved, the power consumption has reached a new low. At the same time, the Tiger Ben T7520 supports full scene coverage, supports 5G NR TDD+FDD carrier aggregation, and uplink and downlink decoupling technology, which can improve the coverage by more than 100%. It supports Sub-6GHz frequency band and NSA/SA dual-module network, and also supports 2G to 5G seven-mode full Netcom. In SA mode, the downlink peak rate exceeds 3.25Gbps.

Yao Jiayang analyzed to reporters: “Because this processor adopts TSMC’s 6nm EUV process, it is the first 5G SoC in the industry to adopt this process. At least it can be confirmed that UNISOC can catch up with the advanced process. The footsteps of major manufacturers such as Qualcomm and Huawei. However, judging from the current product planning of Huawei and Qualcomm, 5nm EUV should be the main focus, so although Ziguang Zhanrui has caught up with the footsteps of major manufacturers such as Qualcomm, it has to cooperate with Qualcomm and other major manufacturers. Together, it may take a while.”

He also said that from the perspective of the configuration of CPU and GPU and the combination of 6nm EUV and other specifications, Ziguang Zhanrui’s strategy should still focus on the mid-end and low-end markets. In addition, the specifications of 5G Modem still do not support mmWave. Look, the T7520 should be targeting the mid-range 5G mobile phone market in China.

Let’s look at the Qualcomm Snapdragon X60. According to reports, the Snapdragon X60 is the world’s first 5G baseband using the 5nm process and also the world’s first 5G baseband that supports the aggregation of all major channels and their combinations. The supported channels include millimeter wave and FDD and below 6GHz. TDD band. In terms of speed, the Snapdragon X60 can achieve download speeds of up to 7.5Gbps and upload speeds of up to 3Gbps. Compared with solutions that do not support carrier aggregation, carrier aggregation in the frequency band below 6 GHz in standalone mode can double the peak rate of 5G standalone networking.

Qualcomm said it plans to sample the Snapdragon X60 in the first quarter of 2020, while smartphones featuring the Snapdragon X60 are expected to launch in early 2021.

This year, Qualcomm’s commercial use of mobile phones is mainly based on X55 with baseband chips. Yao Jiayang told reporters: “From the perspective of the development of the 5G mobile phone market in 2020, there are processors and 5G Modem combination, and 5G SoC (integrated 5G Modem). ) These two, 865+x55 is just one of the combinations, like 765/765G will also be an important main 5G product of Qualcomm this year. Compared with X55, X60, strictly speaking, does not have much specification upgrades, which is roughly the process upgrades, and the introduction of mmWave and sub-6GHz carrier aggregation technologies.”

Commercial competition upgrade

On the one hand, the technology of 5G chips is being updated, Yao Jiayang told reporters: “In the long run, 5G chips will still develop towards an integrated route, and the plug-in method is currently a transitional approach. We believe that the development of 5G SoCs will lead to the development of 5G SoCs. Keep up with Qualcomm’s footsteps and try to integrate mmWave functions into 5G SoCs, while adopting more advanced manufacturing processes. If technology develops, 5G SoCs integrating 5G Modem should become mainstream in 2021.”

At the same time, manufacturers also mentioned more about the commercial situation and user experience at the press conference, and these chips are gradually moving towards the commercial use of mobile phones, CPE, PC and AR/VR.

Mobile phones are the most widely used terminals at present. So far, mobile phone manufacturers have launched more than ten 5G mobile phones. Ziguang Zhanrui also announced for the first time that its 5G chips will be installed in the Hisense F50 mobile phone, and Qualcomm is the most widely used in the Android industry.

The latest research report released by Strategy Analytics pointed out that by 2020, global 5G smartphone shipments will reach 199 million units. But the fallout from the coronavirus outbreak and a slowing global economy will limit 5G smartphone sales this year.

Ken Hyers, Director of Strategy Analytics, said: “Global 5G smartphone shipments will more than tenfold to 199 million units in 2020, up from 19 million in 2019. The 5G segment will be the fastest growing in the global smartphone industry this year. Part. Consumers expect faster 5G smartphones to experience richer content, such as videos or games. We forecast 5G penetration to grow from 1% of all global smartphone shipments in 2019 to 15% in 2020. “

Neil Mawston, Executive Director at Strategy Analytics, added: “The 5G smartphone market was much weaker than expected in the first half of 2020, but we expect the 5G smartphone market to rebound strongly in the second half if the outbreak is contained.”

In addition to mobile phones, Huawei, Zhanrui, etc. have launched CPE products, and Qualcomm also released the second-generation 5G chip platform in VR/AR glasses – Snapdragon XR2, and the 5G chipset used on ARM PC side – Snapdragon 8cx.

Yao Jiayang analyzed to reporters: “XR2 is a high-end product in Qualcomm’s positioning, and 8cx is also a high-end product in the 5G PC field. We believe that the development of the 5G market is still in its infancy. Commercial use, but the overall number is still relatively limited. We believe that the VR/AR and 5G PC markets are mature, and it is conservatively estimated that it may not be possible until 2021, when the consumer market gradually accepts the convenience brought by 5G. “

As the chips become more and more mature, who can finally reduce power consumption and costs faster, and successfully commercialize the card slot, becomes the first echelon, and it is also the focus of everyone’s attention in the 5G mobile era.

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iPhone 12 falls below the issue price, can Huawei beat Apple on Double 11?

The “Grand View” of queuing up all night to buy iPhones may be difficult to reproduce in China.

If we compare the iPhone series over the years, the just-released iPhone 12 is undoubtedly the worst series. As Apple’s first 5G mobile phone, it should have caused an “uproar” in the mobile phone market, but the iPhone 12, which was favored by many industry insiders, fell below the issue price just a few days after its release. As the so-called house leak happens overnight rain, just before and after the iPhone 12 broke, Apple also handed over a financial report that “does not conform to” common sense.

According to Apple’s fourth fiscal quarter (July-September) results for fiscal 2020, Apple’s revenue was $64.7 billion, slightly higher than the same period last year. However, the revenue of Apple’s mobile phone business was US$26.444 billion, a year-on-year decrease of 20.73%. What is more noteworthy is that Apple’s revenue in Greater China was US$7.946 billion, a year-on-year decrease of 28.63%, the lowest level since 2014. And, in Apple’s five major sales regions, only China’s revenue declined. In addition, in the Americas, Europe, Japan, and other Asia-Pacific regions, the growth rate was 5%, 13%, 1%, and 13% respectively.

Chinese consumers no longer love iPhones

According to IDC statistics, iPhone shipments in the third quarter fell by 10.6% year-on-year, ranking fourth after Samsung, Huawei and Xiaomi. Specifically in the Chinese market, iPhone sales fell sharply again in September, down nearly 68-71% year-on-year.

Among them, there are naturally reasons for the delayed sales of the iPhone 12 and the sharp price reduction of the iPhone 11. However, the most fundamental thing is that consumers’ enthusiasm for iphone is also fading after the iphone is no longer able to bring innovative surprises to consumers.

Taking this iPhone 12 as an example, this generation of iPhones does not have any new ideas except that it has to follow the trend and add 5G technology. Even the mystery when the iPhone was not released in the past has disappeared. The retro appearance, performance and parameters are basically the same as those reported on the Internet. There is even no high refresh rate and fast charging iPhone 12, which is not as good as the configuration reported by netizens.

Especially in comparison with other mobile phones, when all mobile phone brands are further developing the third-generation 5G technology and the appearance of mobile phones such as folding screens. The iphone only launched the first mobile phone with 5G function. At the same time, under its retro appearance, there is no new creativity except for the color difference.

In the state that Apple is slow in everything, it also sets off the aggressive mentality of its competitors.

Moreover, the sluggish popularity of the iPhone in the Chinese market is also reflected in the Double Eleven, the largest shopping carnival in the Chinese market. As the only mobile phones with 5nm chips, the iPhone 12 and Huawei Mate 40 both debuted on Double Eleven. According to Tmall’s official data, in the first minute of the opening on November 1, the Huawei Mate40 series, which officially increased its supply, was launched for the first time on Tmall Double 11. The overall turnover of Huawei’s brand exceeded 100 million in seconds, becoming the fastest in the home appliance 3C industry. A billion-dollar brand. In the first hour, the overall turnover of the Huawei brand has exceeded the 500 million mark. At the same time, 6 million people rushed to Tmall to grab Huawei Kirin mobile phones. At the same time, only 5 million people snapped up Apple iPhone series mobile phones.

What is more noteworthy is that Huawei mobile phones are not the only hot sellers. The data also shows that during the whole day of Tmall Double 11, Huawei brand won a total of 5 sales champions in five fields, which shows the great support of consumers. Android tablets, smart watches, Bluetooth headsets, noise-cancelling headsets, routers and other fields have become TOP1 in the industry.

From this comparison, we can find that while the iPhone 12 has fallen below the issue price, the Huawei Mate 40 is hard to find, which undoubtedly confirms many things.

Iphone has become a luxury consumer does not buy it?

For today’s iphone, we should call it a luxury item rather than a technology product.

In fact, as early as when the iphone carried the price banner and technological innovation was squeezed out like toothpaste, the iphone had already fallen to the altar. According to data from research firm Counterpoint, in the first quarter of 2019, in the high-end mobile phone market of US$600 to US$800, the sales of Huawei’s Mate20 and Mate20Pro mobile phones exceeded the iPhone XR and iPhone 8 series at the same price. Then, in 2019, Huawei became the only brand after Apple and Samsung with a double-digit market share in the high-end smartphone segment.

In addition, according to the ranking of the domestic high-end mobile phone market in the first half of 2020 released by IDC, Huawei surpassed Apple and ranked first with a market share of 44.1%, and Apple fell to the second place with a market share of 44.0%.

It can be seen from this that Apple has lost its dominance in the high-end mobile phone market. In the fierce market competition, the iPhone, like the domestic mobile phone, can only rely on low prices to attract users, even though the iPhone 11 is selling well. Although the entry price of the iPhone 12 mini is 5,499 yuan, the same as the previous generation iPhone 11. However, because of environmental protection factors, after cutting off the earphones and chargers, it will undoubtedly increase the cost of consumers to buy mobile phones in disguise.

Especially in the problems of poor external 5G signal, too little battery capacity and too short battery life, the shortcomings of the iPhone are too obvious. Therefore, under the comprehensive experience, the iphone, which is no longer innovative, has poor experience and is expensive, has been increasingly unrecognized by consumers.

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UAV-based optical relay quantum entanglement distribution to achieve more flexible networking

Quantum entanglement is a strange quantum mechanical phenomenon. Two photons in an entangled state have a relationship no matter how far apart they are. One of the quantum states changes, and the state of the other changes instantaneously. The existence of quantum entanglement can be verified by sending two entangled photons to two points, respectively, and observing the projection measurements of the two points. If this feature is applied in the field of communication, it can be observed whether the entangled state of the photons of the two points is lost to judge whether the information has been eavesdropped.

Optical transmission in free space will cause diffraction, resulting in information loss or noise. The use of optical relay stations can ensure greater fidelity of information during transmission, allowing quantum information transmitted over long distances to arrive accurately and safely.

Schematic diagram of UAV-based optical relay quantum entanglement distribution

Not long ago, the research group of Professor Xie Zhenda and Professor Gong Yanxiao of the State Key Laboratory of Solid State Microstructure Physics of Nanjing University, led by Zhu Shining, an academician of the Chinese Academy of Sciences, conducted an experiment between two drones weighing about 35 kilograms, 200 meters apart, and the ground. A small quantum communication network was constructed, and a photon was sent to two telescopes 1 km apart on the ground, and finally high-fidelity photon pairs with entangled properties were measured.

The results were recently published in the flagship journal of physics, Physical Review Letters. The three major international professional scientific media, including “Physics” of the American Physical Society, “Science News” of the United States and “New Scientist” of the United Kingdom, evaluated the significance of research.

Using drones as quantum network relay stations, single-mode fiber receiving and sending signal loss reduction

If you want to build an information transmission network, you must rely on a “relay station”, which is somewhat similar to a base station for wireless mobile communications. If the information can still arrive at the destination accurately after transit, the relay station is required to have low loss and high fidelity.

A year ago, the team attempted to send photons in the air from a single drone to two portable ground stations separately, and achieved the first successful drone-based distribution of entangled photons. At the time, to collect photons, each ground station was equipped with a 26-millimeter telescope, as well as a single-photon detector.

However, a major challenge in the form of optical communication comes from diffraction. As a single photon propagates, its wavefront spreads out like the beam of a flashlight.

If this spreading makes the wavefront larger than the telescope’s aperture, the photons have less chance of being collected. In order to realize the longer-distance transmission of entangled photons, the loss caused by the diffraction of light must be overcome. This requires the construction of a light collimation system, and the relay station is the key.

In this experiment, the research team added a second drone to act as a relay station between the first drone and the ground station.

“We carried a source of entangled photons on a drone and sent one of the photons to a telescope at a ground station 400 meters away. The second photon was then sent to a second unmanned aerial vehicle through a single-mode fiber. On the man-machine, the single-mode fiber with a diameter of 4 microns on the second drone is received and sent to the telescope of the second ground station. The second drone receives the photons in a process similar to focusing lenses, reshaping In this way, the chance of the photons reaching another ground station telescope becomes greater.” Professor Xie Zhenda, one of the corresponding authors of the paper, told the Science and Technology Daily reporter that this is their entanglement in the drone. The optical relay is used for the first time in the optical path of the photon distribution experiment to reduce the loss, and the node of the optical relay is placed on the small UAV in flight state, and the high-precision tracking, receiving and re-targeting of a single photon is realized within the load limit of several kilograms. Launching is like a hundred steps through Yang.

It is gratifying that the experiment was successful. “The measurement found that through optical relay, the distance of entangled photons distributed broke through the diffraction limit of small optical systems. In the case of a distribution distance of 1 km, the S value of Bell’s inequality was measured to reach 2.59. ±0.11, which proves that this optical relay highly maintains the entanglement properties of photon pairs and is an effective quantum link.” Xie Zhenda said.

The network is more flexible, and in the future, it will try quantum transmission at an altitude of 300 kilometers

This achievement has attracted the attention of many internationally renowned academic journals. The American “Physics” commented that “satellites are expensive and difficult to adapt to changing needs on the ground”, while “small drones carrying optical equipment can provide a flexible solution to link multiple users in quantum networks”, “This work could lead to drone-based quantum networks for reconfigurable positioning deployments over urban and rural areas.”

The British “New Scientist” magazine commented that in this work, people have realized the construction of free space quantum links between mobile nodes for the first time. Siddarth Joshi, University of Bristol, UK, commented in an interview with New Scientist magazine, “This achievement marks an important step towards quantum internet, when you want to maintain secure quantum communication while driving, these drones Can fly around behind your car (to stay connected).

The American “Science News” commented: “People may access the quantum Internet through drones, and in the future, swarms of drones can work together to send entangled photons to receivers in various locations.”

Xie Zhenda said that in the future, quantum information can be exchanged between multiple drones through relays, so that the information can be transmitted farther and spread wider. “Quantum transmission between drones is not affected by fixed optical fiber transmission, has no medium loss, and can be flexibly networked according to needs, such as temporary networking, multiple networking in quantum communication in emergency and emergency scenarios. .”

Looking forward to the future, Xie Zhenda introduced that small drones can be used to achieve local area networking and even cover moving vehicles. These devices can be linked to satellite and optical fiber systems to achieve global quantum networking. “In the future, we will also try to use mobile platforms with higher cruising altitudes, such as fixed-wing aircraft or balloons, to achieve a single-link connection of more than 300 kilometers, which can be unaffected by the beam distortion caused by atmospheric pollution and weather environment, and build a wide range of Domain Mobile Quantum Link.”

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Microchip Introduces 3kW TVS Diode Array Products for Superior Circuit Protection in Harsh Environments

Aerospace systems rely on digital and logic functions and circuits in engine control units, environmental controls, instruments and actuators to do critical work. Data centers, 5G infrastructure and communication systems also rely on complex circuits that need to be properly protected. Even with voltage surges and spikes caused by lightning, solar activity and electromagnetic accidents, the system must remain in continuous operation. Microchip Technology Inc. today announced the launch of its newest vertical array portfolio of transient voltage suppressors (TVS), the MDA3KP transient voltage suppressor (TVS). This 3kW diode series features more than 25 products with different screening levels, polarities and certification standards.

Microchip’s MDA3KP TVSdiode arrayThe series offers an integrated multi-diode solution, is the only technology that offers a wide voltage range, and has been tested to high reliability standards to MIL-PRF-19500 JANTX level equivalents. These voltage clamp devices feature fast-acting avalanche breakdown diodes (ABD) that divert excess current around sensitive components to protect them from electrical overload.

“Digital control, logic and diagnostic system circuit modules require highly reliable, safe current and power protection to ensure operation in extreme environments,” said Leon Gross, vice president of Microchip’s Discrete Division. “This diode family addresses the challenges system designers face. challenges, it has a more efficient vertical structure and smaller board space requirements than other devices.”

Currently available MDA3KP TVS diode arrays meet industry standards for the following screening types: M, MA, MXL and MX. These devices have undergone various levels of testing to ensure that they meet the aircraft lightning protection requirements specified in RTCA DO-160E (Lightning Induced Transient Susceptibility), an environmental test standard for avionics. RTCA (Radio Technical Committee for Aeronautics) is an industry alliance dedicated to building consensus on key issues of aviation modernization.

The MDA3KP TVS diode array uses a structure with 8 diodes placed vertically and is packaged in a 16-pin surface mount package. This product enables efficient layout and simplified design due to less printed circuit board space required and higher power density. All devices in the MDA3KP TVS Diode Array Family are vertically structured and can power up to 8 smaller devices on a single printed circuit board, thus enabling higher power without multiple devices.

The device features both unidirectional and bidirectional constructions, isolation voltages from 6V to 40V, Electrostatic Discharge (ESD) and Electrical Fast Transient (EFT) protection according to IEC standards, and a peak pulse power rating of 3000 watts (10/1000 µs) . Over the extended temperature range of -55°C to +150°C, the devices feature batch traceability, surge testing, and Moisture Sensitivity Level (MSL) Level 1 – indicating that these devices can be used in harsh environments. MSL states that no dry packaging or drying is required before use. The power rating of the MDA3KP TVS diode array family is the only technology available in the industry with this screening level in this package.

Microchip’s 3kW MDA Diode Family Provides Military Systems for Rugged Handheld Radio, Global Positioning System (GPS), Communications Test Equipmentcircuit protectionand can also be used in automotive, industrial logging equipment, energy supply and marine systems.


To purchase the above products, please contact a Microchip sales representative.

About Microchip Technology Inc.

Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and broad product portfolio enable customers to create optimal designs that reduce risk while reducing total system cost and time to market. Microchip’s solutions serve more than 120,000 customers in the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip provides outstanding technical support, reliable product delivery and exceptional quality.

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China Telecom and Lantu Automobile to build the first 5G Internet of Vehicles project in Hubei

Dongfeng Lantu FREE new energy vehicle equipped with 5G IoT information technology

Recently, with the official launch of Dongfeng Lantu FREE new energy vehicle, the first 5G Internet of Vehicles project in Hubei Province jointly built by China Telecom and Lantu Automobile was officially put into operation in Wuhan. This cooperation marks the official launch of the first 5G application in the auto industry in Wuhan. This project is the first integration of 5G customized network and civilian vehicles. The successful implementation of the project will accelerate the development of the Internet of Vehicles and provide a solid technical foundation for the realization of intelligent driving applications such as autonomous driving and vehicle-road coordination. As the only IoT card supplier for all models of Lantu, China Telecom has completed the entire business process of Lantu’s IoV function from planning, development, testing to online delivery.

In this project, China Telecom’s IoT platform is directly connected with Lantu’s vehicle platform to provide Lantu with system integration services based on IoV traffic, SMS, and voice, including the operation of IoV platform, SMD card monitoring and traffic flow. Comprehensive services such as analysis, realize high-speed vehicle-machine interconnection, cloud computing machine learning, remote diagnosis, vehicle authorization remote control and other functions. At the same time, through the 5G network slicing technology, it provides car owners with security isolation and privacy protection of human and vehicle data.

Dongfeng Lantu FREE new energy vehicle equipped with 5G IoT information technology

In the telecommunications exhibition hall of the 24th International Optoelectronics Expo, a Dongfeng Lantu FREE new energy vehicle carrying the telecommunications 5G Internet of Things information technology was displayed. People sat in the driver’s seat and felt the high-speed experience brought by the 5G network. . The IoV solution provided by China Telecom takes full advantage of the dual advantages of network + platform, and uses the 5G customized network to cooperate with Lantu’s highly customized management platform to provide car companies with reliable data, voice, and SMS security. Real-time acquisition of vehicle data, edge analysis and rapid feedback. Among the most popular applications are intelligent applications such as in-vehicle intelligent assisted driving systems, automatic parking covering a wide range of scenarios, 360 panoramic images and transparent chassis. These functions ensure that car owners are safer and more convenient in driving and operation.

“When each vehicle leaves the factory, there will be a China Telecom 5G vehicle-grade IoT card SMD card built in. The IoT card is supported by the 5G network and utilizes 5G’s large bandwidth and low latency to realize real-time vehicle data download and key The data is uploaded to the car company management platform in real time, and OTA can be quickly upgraded with the help of 5G high speed, and functions such as in-vehicle Internet and car-machine navigation can be realized based on 5G precise positioning.” Peng Lin, director of the Industrial Internet Service Department of China Telecom Wuhan Branch, introduced, “In fact, it is Establishing an information wing for each vehicle, China Telecom’s 5G IoT card enables the vehicle body to provide users with more diverse smart services.

Compared with traditional vehicles, the interconnection delay between the Lantu new energy vehicle and the platform carried on the 5G IoT card is smaller, and the information can be monitored and processed in real time. At present, the automatic driving function of the vehicle has basically realized the rapid information exchange with the relevant sensing equipment. Through the high-speed upload of information, the functions of vehicle positioning, vehicle navigation, and vehicle alarm transmission are realized. Compared with the past, after the vehicle has set the relevant information, when the user uses the automatic cruise function, not only the following technology can be realized, but also the turning at a specific intersection and the lateral interaction (obstacle avoidance) function of the left and right vehicles.

In the context of the country’s strategy of vigorously developing new energy vehicles, China Telecom and Dongfeng have jointly deployed a new generation of vehicles represented by new energy and intelligent connectivity, using 5G, AI, Internet of Things, cloud computing and other new technologies to empower products , to promote the development of 5G + Industrial Internet.

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Achieve each other!Qualcomm to supply chips for BMW’s self-driving cars

Yesterday, Qualcomm announced that BMW will use Qualcomm’s chips in its next-generation driver assistance and autonomous driving systems.

A BMW spokesman said the new chips from Qualcomm will be used in its “Neue Klasse” line of cars, which will begin production in 2025.

“Neue Klasse” is a milestone project in BMW’s transition to electrification, digitalization and autonomous driving.

Qualcomm and BMW will use dedicated Qualcomm Computational Vision Processors to analyze data from front, rear and surround view cameras. BMW will also use Qualcomm central processing units and another Qualcomm chip to help cars communicate with cloud computing data centers.

Qualcomm, the world’s largest supplier of mobile phone chips, has been looking to diversify its business. Automotive chips are a key growth area for Qualcomm, which has been challenging self-driving chips. The cooperation between Qualcomm and BMW will help promote the diversification of Qualcomm’s business.

It is worth noting that TrendForce recently released the revenue ranking of the top ten IC design companies in the world in the second quarter of 2021.

Among them, Qualcomm ranks first in terms of revenue. Driven by the still considerable demand for 5G high-end and flagship models from major mobile phone manufacturers, its processor and RF front-end departments have experienced strong revenue growth; The continuous demand for remote work and teaching caused by the epidemic has made the IoT division’s revenue of nearly US$1.4 billion, becoming another major revenue driver of Qualcomm, driving its revenue in the second quarter to US$6.47 billion, an annual growth rate of 70%. %.

In addition, according to public announcements, BMW’s October sales were better than expected, and November sales got off to a good start. According to the announcement, the company’s third-quarter net profit rose 42.4% to 2.58 billion euros (2.93 billion US dollars). Gulas Peter, the company’s chief financial officer, said it expects BMW to earn a profit forecast of 9.5% to 10.5% this year. (Cover image source: Paixin.com)


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