Can the monopoly be broken?Jiefa Technology pushes tire pressure monitoring chip

A few days ago, NavInfo announced that the first tire pressure monitoring sensor chip AC5111, designed by its automotive Electronic chip design company Jiefa Technology, has been officially mass-produced. It is reported that the tire pressure monitoring sensor chip has received tens of thousands of mass production orders.

  Can the monopoly be broken?Jiefa Technology pushes tire pressure monitoring chip

The tire pressure monitoring sensor chip is mainly used for real-time monitoring of tire pressure during driving, and early warning of tire leakage and low pressure to ensure driving safety. According to statistics, 70% of highway traffic accidents in China are related to tire blowouts. In order to reduce the accident rate, in 2013, the National Standards Committee issued the “Performance Requirements and Test Methods for Passenger Car Tire Pressure Monitoring System”, pointing out that from January 1, 2020, all passenger cars in production will be forced to install tire pressure Monitoring System.

At present, most of the tire pressure monitoring sensor chip manufacturers in the industry are foreign companies, such as Infineon, Freescale, NXP, etc. Infineon is recognized as one of the best manufacturers in this field. Due to the weak strength of my country’s semiconductor industry, the chip market is mostly controlled by foreign companies, while domestic companies mainly focus on tire pressure monitoring system integration. The main companies include Baolong Technology, Iron General, and Lianchuang Electronics.

  

Jiefa Technology just saw the huge market opportunity for tire pressure monitoring chips, and hopes to gradually realize the autonomy of domestic chips through the AC5111 chip. According to official information, Jiefa Technology’s AC5111 chip consists of six functions: microprocessor (MCU), air pressure sensor, temperature detection, acceleration sensor, high-frequency radio frequency technology and low-frequency radio frequency technology. AC5111 is Jiefa Technology’s first product line in the field of MEMS chips. This chip will be produced by MEMS (Micro Electro Mechanical Systems) foundry X-FAB, which is also the world’s top foundry. . In the future, Jiefa Technology’s new products such as smart cockpit chips, ADAS (advanced driver assistance system) chips, and other automotive MEMS sensor chips will also be introduced to the market one after another.

The Links:   NL128102AC31-01 MG150Q2YS50

Smart Sensor Manufacturing Innovation Alliance: Gather cores and talents, win-win cooperation, and create “Hui” brilliance again

In order to implement national strategies such as Made in China 2025, the integrated development of manufacturing and the Internet, and big data, grasp the strategic opportunity period for in-depth adjustment of new generation information technology, enhance the core competitiveness of the smart sensor industry, and ensure national information security, November 23, 2017 The Ministry of Industry and Information Technology formulated the “Three-Year Action Guidelines for the Smart Sensor Industry (2017-2019)” in accordance with the requirements of the “National Integrated Circuit Industry Development Promotion Outline” and in combination with the “Action Plan for Accelerating the Development of the Sensor and Intelligent Instrumentation Industry” . The “Action Guide” supports the construction of national and provincial intelligent sensor innovation centers, relying on scientific research institutes and key enterprises with good basic conditions to jointly establish independent legal entities in the form of capital or intellectual property rights, forming a group of intellectual property and core The key technology of competitiveness has succeeded, a group of new compound talents have been cultivated, and the core device design and manufacturing technology has reached the international level.

As one of the three major sensor R&D and manufacturing bases in China, Bengbu has a number of intelligent sensor R&D, design and manufacturing enterprises, such as the No. 214 Research Institute of China Ordnance Industry, Xi Magnetic Technology, and North Core Dynamics, and has established a MEMS joint engineering laboratory. Approved major R&D projects above the provincial level, and established the Anhui Intelligent Sensor Industry Innovation Alliance.

Following the trend, relying on the platform of “Anhui Intelligent Sensor Manufacturing Innovation Center”, in November 2019, led by the No. 214 Research Institute of China Ordnance Industry, in conjunction with the Department of Precision Instruments of Tsinghua University, SAIC Group Technology Center, and Suzhou Biomedical Sciences of the Chinese Academy of Sciences Engineering Technology Research Institute, Anhui Heli Group Corporation, Anhui Innolink Microsystems Co., Ltd., Hefei Micro-Nano Sensing Technology Co., Ltd., Anhui Auf Medical Equipment Technology Co., Ltd., Anhui Hongshi Automation Equipment Co., Ltd., Hangzhou Chi Orange Digital Technology Co., Ltd. and other units jointly established the “Intelligent Sensor Manufacturing Innovation Alliance (Center)”.

According to the relevant person from the China Ordnance Industry No. 214 Research Institute, the governing unit of the Smart Sensor Manufacturing Innovation Alliance, the smart sensor industry is a basic industry for national economic and social development, and the mutual support with the integrated circuit industry determines the country’s core competitiveness. and international status. In the R&D system of smart sensors in my country, each R&D institution has been in a situation of independent management for a long time, and repeated research is not uncommon, which not only wastes resources, but also prolongs the R&D cycle of new technologies and reduces the economic and social benefits that new technologies can produce. The establishment of the innovation alliance can gather resources from all parties, optimize the allocation of resources, establish a rapid response mechanism for research and development, attract high-end talents at home and abroad, maximize the use of limited resources to produce maximum benefits, and strengthen industry-university-research cooperation. Completely breaking the technical blockade of my country’s smart sensor field by western countries, it will play a huge role in promoting the development of my country’s sensor core technology, will further enhance the smart sensor innovation capability of Anhui Province and even the country, and further enhance the international competitiveness of my country’s core technology. Realize the autonomous control of intelligent sensors.

Since the establishment of the Smart Sensor Manufacturing Innovation Alliance more than a year ago, what major progress has been made? The Core Thought Research Institute made a special trip to visit the alliance to obtain first-hand information.

Since its establishment in 2019, the Innovation Alliance has been centered on the 214th Research Institute of China Ordnance Industry, relying on the institute’s 6-inch 0.5μm semiconductor process line, 6-inch MEMS process line, optoelectronic device process platform, silicon-based terahertz IMPATT (avalanche) Diode) chip process platform, Electronic module and component SMT (surface assembly technology) process platform, H-class thick film hybrid integrated circuit military standard line, 8-inch LTCC production line seven process platforms and process capabilities and the design capabilities of related companies in the alliance, combined with The alliance’s industrial focus adjusts the layout, promotes the development of the MEMS smart sensor industry as a strategic emerging industry, and combines the technical characteristics of the alliance to determine the high-performance inertial devices, optical communication devices, infrared temperature sensors, gas sensors, micro-flow sensors, pressure sensors. And all kinds of intelligent sensor fields are the development direction of key industries. Benchmarking the international advanced technology, while giving full play to the ability of independent innovation, four sets of characteristic MEMS bulk silicon process systems have been established, and the alliance’s MEMS research and development capabilities and industrialization capabilities have been continuously improved, and efforts have been made to build a domestic advanced MEMS smart sensor industry base.

For more than a year, the Innovation Alliance has mainly expanded applications in five fields:

First, high-performance MEMS devices and components for artificial intelligence and unmanned systems: autonomously controllable MEMS inertial devices (gyroscopes, accelerometers) and components have formed an absolute leading position in the domestic high-end MEMS inertial device market and can be widely used In the field of drones and smart cars;

The second is the field of 5G communication and the Internet of Things, including MEMS optical components, MEMS actuators, and radio frequency MEMS devices: silicon-based filters, power dividers, antennas and other products have been developed, and related products have industrialization capabilities, relying on 5G communication. The field has huge market prospects. Combined with the current alliance’s mature MEMS device wafer processing, packaging and testing as an integrated process platform, while improving the localization level of my country’s optical communication core devices, it will take the lead in occupying the strategic commanding heights of the 5G optical communication field;

The third is the field of MEMS sensors for smart equipment: mainly used in industrial monitoring, smart mobile terminals, wearable devices and other fields;

The fourth is the field of high-end medical equipment: the outbreak of the new crown pneumonia in 2020, the response to the epidemic highlights the need to speed up the completion of the shortcomings of high-end medical equipment, accelerate the research on core technologies, break through the technical bottlenecks, and realize the independent control of core components for medical equipment;

The fifth is the field of MEMS devices for smart homes: with the rapid development of the Internet of Things, gas sensors, array infrared temperature sensors, and pressure sensors used in the field of smart homes have been jointly developed and realized 6 product series.

Major breakthroughs in technological innovation

The Innovation Alliance adheres to the technological innovation system of deep integration of production, education and research, and has added nearly ten major scientific research projects at the provincial and national levels in the field of smart sensor technology, involving MEMS, EMCCD, SOC, microwave and millimeter wave, digital-to-analog conversion, power devices, etc. For example, the 214th Research Institute of China Ordnance Industry, a member of the alliance, has successively won a number of major national, provincial and ministerial scientific research projects. Expand the alliance’s main technologies and products to the automotive field, and at the same time expand the alliance’s vertical scientific research to the key project areas of the National Development and Reform Commission; the “Nuclear High Base” major project jointly declared with Tsinghua University has been extended from the “13th Five-Year Plan” to the “14th Five-Year Plan”. ; The “Digital diagnosis and treatment equipment research and development” project in cooperation with the Suzhou Institute of Biomedical Engineering and Technology of the Chinese Academy of Sciences has been successfully approved as a key research and development plan by the Ministry of Science and Technology. For more than a year, the alliance member units have authorized more than 30 invention patents and published 15 core journal papers.

In terms of key technologies, through technological innovation, cultivating core technologies, relying on the nuclear high-based national major science and technology special projects, we have overcome a series of key technologies that plague the MEMS industry: such as 6-inch SOI bulk silicon MEMS process lines in MEMS microstructure key dimensions processing The precision is better than 0.3μm, the repeatability is better than 0.5μm, and the processing verticality is better than 90°±0.1°; in terms of EMCCD, with the independent EMCCD device as the core, it has completed the nationalized EMCCD search with completely independent intellectual property rights With the development of tracking system, by optimizing the component structure, improving the ability of component video image acquisition and transmission and video image processing, EMCCD process development and product engineering have made great progress; in terms of LTCC devices, it has a complete LTCC production line and group packaging production line , established a multi-material, multi-interface system process, special-shaped multi-cavity structure, high-density integration, LTCC radio frequency devices, components and micro-system manufacturing technology platform, at the leading domestic level.

In terms of basic technology, the anti-overload capability of gyroscope and acceleration has reached more than 18500g, reaching the domestic leading level; developed high-reliability silicon-silicon direct bonding, eutectic bonding, glass paste bonding, electrostatic bonding and thermocompression bonding technology, forming the most complete bonding process technology in China, and is the only domestic enterprise with two silicon-silicon bonding processes; developed unequal-height comb tooth etching technology, reaching the domestic leading level; completed some 3D advanced microsystems The single process technology of integrated manufacturing has laid the foundation for the research and development of microsystem products.

Accelerate the pace of industrialization development

The alliance adheres to the policy of “demand traction, focus on the main business, emancipation of the mind, and win-win cooperation”, unswervingly cooperate with foreign countries, expand cooperation resources, and encourage multiple channels to establish scientific research and industry with universities, research institutes, and enterprises within and outside the alliance. Cooperation to establish a close industrial cooperation ecological chain. Focusing closely on MEMS, sensors and other industries, put the promotion of the industrialization of MEMS devices in the first place, and strive to achieve a national level of MEMS professional technology by the end of 2022, tracking in cutting-edge fields, and industrial development. Quality development.

Based on the 6-inch MEMS process platform and the 6-inch 0.5μm semiconductor process platform of the 214th Research Institute of China Ordnance Industry, six major product directions are formed:

(1) MEMS inertial devices: Co-designed and jointly developed with Innolink, a member of the alliance, 9 MEMS gyroscopes, 7 MEMS accelerometers, 5 micro-inertial measurement modules and other series of shelf products have been formed, and the core indicators have been completed. Covering similar foreign products, it can be used in drone attitude measurement, intelligent robot-assisted navigation, bridge health detection and diagnosis and other fields.

(2) Optical MEMS devices: Co-designed and jointly developed 9 optical MEMSM micromirror products including tunable optical attenuators, optical switches, and tunable optical filters with the alliance member company Zhongke Mi Micro Co., Ltd., 3 A MEMS scanning mirror, during the “14th Five-Year Plan” period, it will increase the cooperation and development of a series of products in the fields of optical communication, optical sensing, optical Display, and lidar;

(3) MEMS infrared temperature sensor: Through the joint design and joint development with the alliance member units Hefei Micronano Company and Suzhou Rongqi Company, three types of MEMS temperature sensor products, two types of unit type and array type, have been formed. Temperature sensors are highly flexible and have the advantages of testing moving targets. The “14th Five-Year Plan” will focus on increasing product iteration and industrialization in industries such as smart home and healthcare;

(4) MEMS gas sensor: Co-designed and jointly developed with Hefei Micro-Nano Company, a member unit of the alliance, breaking through the stress matching of composite dielectric films and the high-precision patterning process of refractory metals, realizing localization, mainly detecting CO, VOC, NO Waiting for gas, the “14th Five-Year Plan” will break through the complete set of batch production process of three-dimensional heating table, further reduce the power consumption of the sensor, and improve the performance of the sensor;

(5) MEMS micro-flow sensor: Jointly develop MEMS micro-flow sensor with related companies for use in the field of inkjet printers, which is still a bottleneck in China. The successful breakthrough of this technology will lead the transformation of the inkjet printing industry with innovative MEMS technology, and will bring new market opportunities for industrial applications such as textiles, packaging, and printed electronics.

(6) MEMS pressure sensor: 6 types of pressure sensors have been developed to tackle key problems. The products are made of MEMS pressure sensor sensitive chips through SOI process, pressure cores formed by encapsulating the sensitive chips through metal isolation and liquid filling, as well as various types of conditioning completed with special ASIC chips. Transmitter products are mainly used in aerospace, ship-based ships, petrochemical and other fields. The micro-pressure sensor under development will be widely used in the field of medical health in the future.

Innovation Alliance work to innovate

During the “14th Five-Year Plan” period, the “Intelligent Sensor Manufacturing Innovation Alliance (Center)” with the leading innovation capability in China will be built, a group of high-tech enterprises in key links of the industrial chain will be incubated, and some technologies and products will reach the international leading level, leading Anhui Province to become an integrated It is an internationally competitive and domestically leading smart sensor industry cluster that integrates R&D, manufacturing and service.

During the “14th Five-Year Plan” period, the alliance will further accelerate the transformation of scientific and technological achievements and the development of military-civilian integration, give full play to technological advantages, promote the effective combination of technology, market and capital, and learn from the successful experience of the Microsystem Institute in exploring the establishment of a fund management platform company. The 214th Research Institute of the Ordnance Industry Co., Ltd. jointly initiated the establishment of an industrial fund jointly with provincial and municipal local governments, Zhongbing Investment and upstream and downstream enterprises in the industrial chain. The fund focuses on investments in the upstream and downstream R&D design, raw material production, equipment manufacturing, wafer processing, packaging and testing of the MEMS industry chain, and pays particular attention to design companies with technical advantages in the mainstream MEMS product direction of the alliance.

During the “14th Five-Year Plan” period, the alliance will take the lead, integrate the advantageous resources of each member unit, and jointly apply for scientific and technological innovation projects including the National Development and Reform Commission, the Ministry of Industry and Information Technology, and the Ministry of Science and Technology, so as to enhance the alliance’s influence in the industry.

During the “14th Five-Year Plan” period, priority will be given to opening the seven existing technology platforms of the 214th Research Institute of China Ordnance Industry to the member units of the alliance, and organizing the formulation of preferential policies for the transformation of project achievements among members of the alliance, so as to provide better quality for the industrialization development of the alliance. service.

The Links:   NL12876BC26-22E F4-150R06KL4

Research team develops conductive polymer patch that can connect hearts to bridge scar tissue?

A research team led by Associate Professor Michael Monaghan at Trinity University Dublin, Ireland, has developed a conductive polymer patch that can help repair damaged hearts, designed to attach to the outside of the heart and bridge areas of scar tissue. A related research paper was recently published in the journal Advanced Functional Materials.

It is understood that after a heart attack, some of the beating heart muscle tissue is eventually replaced by non-beating scar tissue, which permanently impairs the function of the heart. Once implanted in the heart, the patch would be able to pick up electrical signals from surrounding heart cells, propagate their signals across the gap, and expand and contract in time with them. So far, the researchers have tested the patch on isolated biological tissue and plan to conduct animal experiments.

The patch is made of a medically-approved stretchable polymer and coated with a mesh-like layer of a separate conducting polymer – polypyrrole. This is done through “melted direct write” technology developed by Spraybase, a spin-off company of Trinity University Dublin.

We have seen other experimental “cardiac patches” previously designed to perform a similar function. While many of the previous experiments have integrated actual living heart cells, the new patch is designed to work alone, and it can also work with added cells for enhanced function.

The Links:   LM150X08-TLC1 PM150CVA120 COMPONENTS

A single TDA 4 parking lot, opening a new chapter of intelligent driving

In the process of vehicle intelligence, electrification, and networking, many companies in the field of intelligent driving have taken root and grown, introducing intelligent driving technology into real life. We see more cars equipped with powerful ADAS functions, and more advanced autonomous driving solutions are becoming more and more mature in the process of transitioning from scenario-centric autonomous driving technology to the driverless stage. Functions such as Automatic Parking (APA), Home Area Memory Parking (HAVP), Traffic Jam Assist (TJA), High Speed ​​Assisted Driving (HWA), and Automatic Navigation Assisted Driving (NOA) have become familiar to ordinary car owners and are no longer professional. People talk on paper.

Author: Fredy Zhang

In the process of vehicle intelligence, electrification, and networking, many companies in the field of intelligent driving have taken root and grown, introducing intelligent driving technology into real life. We see more cars equipped with powerful ADAS functions, and more advanced autonomous driving solutions are becoming more and more mature in the process of transitioning from scenario-centric autonomous driving technology to the driverless stage. Functions such as Automatic Parking (APA), Home Area Memory Parking (HAVP), Traffic Jam Assist (TJA), High Speed ​​Assisted Driving (HWA), and Automatic Navigation Assisted Driving (NOA) have become familiar to ordinary car owners and are no longer professional. People talk on paper.

At present, in the process of the evolution of the Electronic and electrical architecture of the whole vehicle from distributed to centralized, the parking function and the driving function are integrated, and more and more parking-integrated technical solutions, namely intelligent driving domain controller solutions, have emerged. The multi-chip line-parking integration solution has been widely used. Driving and parking are integrated from two separate systems into one. For the function and performance of the system, while improving the performance, it brings consumers a seamless intelligent driving experience between multiple different scenarios. Based on the mass production of the dual-TDA4VM parking and parking integration solution, while bringing extraordinary experience to users, we also see the improvement of intelligent driving technology and huge imagination space.

The integrated solution based on dual TDA4VM has been mass-produced. At the same time, with the improvement of algorithm software maturity, the emergence of higher-performance chips, and the system cost advantage, the single-chip TDA4 line-parking integration solution has become an ideal choice for the line-parking integration solution. From the current form, there are two ways to achieve it: one is to realize a single TDA4VM/VMeco integrated solution with AI computing power of about 8TOPS based on a single TDA4VM or TDA4VM Eco. This solution uses time-sharing multiplexing. The sensor system can be configured as 5V5R or 6V5R; the other is based on a single TDA4VH or TDA4VM Plus to achieve an AI computing power of 24~32TOPS single TDA4VH/VM Plus integrated solution for parking, computing Stronger, more cameras can be connected.

The single TDA4VM/TDA4VM Eco parking and parking integration solution is shown in the figure below. It needs to extract data from different sensors and convert it into vehicle driving information. These sensors need to be equipped with different types of cameras, millimeter-wave radars and ultrasonic sensors, etc. This solution shows the 5V5R solution, that is, 5 cameras and 5 millimeter-wave radars. The number and type of sensors can be adjusted according to the needs of users.

The single TDA4VH/TDA4VM PLUS integrated solution for traveling and parking is shown in the figure below. It has higher computing power (a single chip can reach 24-32TOPS) and can connect to more cameras. For example, the following 10V5R solution uses 10 cameras and 5 millimeter-wave radars to realize the solution of traveling and parking. The number and type of sensors can be adjusted according to the user’s needs.

1. Functional aspects: A single chip can realize rich driving and parking functions

a. Driving: Blind Spot Detection (BSD), Door Open Warning (DOW), Lane Departure Warning (LDW), Forward Collision Warning (FCW), Intelligent High Beam Control (IHC), Forward Travel Warning (FCTA), Rear Cross Traffic Alert (RCTA), Rear Collision Alert (RCW), Adaptive Cruise Control (ACC), Lane Keeping Assist (LKA), Manual Lane Change (PLC), Traffic Jam Assist (TJA), High Speed ​​Assisted Driving (HWA), Automatic Emergency Braking (AEB), interactive highway automatic driving (HWP), interactive highway congestion automatic driving (TJP), automatic assisted navigation driving (NOA) and other functions;

b. In terms of parking, functions such as panoramic function (AVM), automatic parking assistance (APA), remote parking assistance (RPA), and home area memory parking (HAVP) can be realized;

2. Safety aspects: TI Jacinto7 processor integrates HSM to achieve information confidentiality, and internally integrates ASIL D MCU. This enables the user’s products to meet the quality and functional safety and information security objectives of the vehicle.

3. Scalability: The importance of a high-performance system-on-chip (SoC) is that it can perform parallel processing. The TI Jacinto7 processor belongs to a heterogeneous multi-core architecture. In addition to ARM A72, digital signal processing C7x/C66, MCU R5F and other computing cores, the internal VPAC, DMPAC The accelerator effectively reduces the load on the main core, so that applications can be deployed flexibly and promote continuous function customization and expansion.

4. Computing power: Jacinto7 provides users with a single chip of 0~32T computing power, a single C7x/MMA can achieve 8TOPS computing power, the series is divided into different versions according to the configuration, which can meet the needs of cost reduction and function expansion.

5. Cost aspect: TDA4 series effectively saves system cost with advanced integration. The TDA4 series processor integrates the ASIL-D MCU core, and no external MCU is needed; the interface is rich, and the SOC integrates multiple CAN-FD interfaces, Ethernet, PCIe switches, etc.; built-in ISP, the camera does not need an external ISP.

The development of the system must be cost-effective in order to achieve widespread and effective use. With the maturity of the algorithm software, the multi-chip TDA4VM integrated solution has been mass-produced. It has a high degree of openness, high flexibility, and integrated parking, effectively balancing computing power, cost and power consumption. Rich driving and parking functions and high-safety systems provide users with a safe and comfortable immersive driving experience.

In the future, the integrated parking solution based on a single TDA4VM Eco/TDA4VM PLUS/TDA4VH can be extended from simple scenarios (fewer sensors, lower resolution) to more complex scenarios, opening a new chapter in intelligent driving. It will help to reduce the cost of the system, so as to realize the popularization and popularization of ADAS technology.

The Links:   LTM190E1-L03 CLAA150XG04

U.S. Navy looks at free-space laser communications to transmit wireless data to users 6 miles away

U.S. Navy communications experts are looking for companies that can develop laser communications systems that can maintain communications links between fixed or mobile laser transmitters and receivers.
Officials at the Naval Information Warfare Center (NIWC-Atlantic) in South Carolina released a request for information for the Free Space Optical Communications program last week.
Free space optical communication uses a light source (usually a laser) propagating in free space to transmit wireless data for telecommunication or computer networking. Free space refers to the sky, space, vacuum or similar space without the use of solid objects such as fiber optic cables.
Naval researchers want at least Level 4 tactical free-space optical communications technology information for the technology, which describes components that are assembled and tested together in a lab.
Technologies of interest include active pointing and tracking systems for maintaining links in dynamic environments. Tactical free-space optical communication systems of interest include fixed point-to-point transmitters and receivers that can be adapted for active pointing and tracking systems.
Naval researchers are looking for free-space optical communications solutions that support multiple access from distributed end-users through automated network management and MIMO tactical free-space optical communications or non-targeting through relay or retransmission Line tactical free space optical communications.
A tactical free-space optical communication system should be able to establish non-line-of-sight links via relay or retransmission; includes active pointing and tracking systems and automated network management, and has been demonstrated in the lab.

The Links:   MG200Q2YS11 LJ64ZU49

Xiaomi CEO Lei Jun: Production capacity is restored, Xiaomi Mi 10 mobile phone is open for purchase today

On March 20, Xiaomi CEO Lei Jun said that with the progress of the domestic war epidemic, factory production capacity is gradually recovering. Yesterday, Xiaomi mobile phones and Redmi have fully resumed work. Recently, Lei Jun officially released the Mi 10 and Mi 10 Pro mobile phones to the public. The Xiaomi Mi 10 series mobile phones are equipped with the latest flagship Snapdragon 865 processor.

At the same time, Xiaomi Mobile officially stated that today is the day when Xiaomi Mi 10 is open for purchase. And Xiaomi Changcheng also said that Xiaomi Mi 10 has successfully hit the high-end flagship in the Chinese market and has been open for purchase.

The Xiaomi Mi 10 Pro mobile phone is equipped with the latest flagship Snapdragon 865 processor, and the whole series adopts LPDDR5 memory, WiFi 6, UFS 3.0 storage, 100-megapixel camera, etc. Previously, the Mi 10/Pro has been sold for several rounds. There is also a 90Hz custom AMOLED curved screen, and the Mi 10 is equipped with a 4780mAh custom bar-shaped fast charging battery, which supports 30W wired fast flash charging + 30W wireless fast flash charging + 10W wireless reverse charging.

Recently, Lei Jun also announced the launch of a free film event for the Xiaomi Mi 10 series, and supports two-way free shipping, from March 18th to March 31st. Xiaomi Mi 10 series users can participate in in-store service, intra-city postal delivery, customer service, etc. through the Xiaomi after-sales service official account.

The Links:   2RI100E-080 L312F BUYPART

ASUS launches new computing stick: equipped with Atom processor, 4+64GB configuration

According to foreign media AnandTech, this week ASUS launched a new VivoStick computing stick, equipped with Atom Atom processor and Windows 10 Professional Edition system.

According to reports, the Asus VivoStick PC TS10 launched in 2017 is equipped with Intel’s Atom X5-Z8350 SoC, equipped with 2GB LPDDR3-1600 memory and 32GB eMMC storage. The latest upgraded VivoStick model is TS10-b174d, which follows the old design and SoC, but comes with 4GB of LPDDR3 memory and 64GB of storage. In addition, the new system runs Microsoft’s Windows 10 Professional, replacing the Windows 10 Home edition used in the original model.

IT Home has learned that Intel’s Compute Stick is an ultra-compact PC design that can be used when connected to a monitor. However, due to the limitations of its performance design, not many manufacturers have followed up. Asus has yet to announce the price of the new Compute Stick.

The Links:   LM64K104 LM-BG53-24NEK SKM200GAL126D

AI’s deep learning algorithms analyze medical samples with automation and standardization

Researchers from the Helmholtz Zentrum München in Munich and the University Hospital of LMU Munich have shown for the first time that a deep learning algorithm performs similarly to human experts when classifying blood samples from patients with acute myeloid leukemia (AML). Their proof-of-concept study paves the way for automation, standardization and field sample analysis in the near future. The paper was published in Nature Machine Intelligence.

 

AI’s deep learning algorithms analyze samples in an automated and standardized way. Left: Classification of human experts. Right: Pixels important for AI analysis.

Every day, millions of single cells are diagnosed in medical laboratories and clinics for disease diagnosis. Most of the repetitive tasks are still done manually by trained cytologists, who examine cells in stained smears and classify them into about 15 different categories. There is taxonomic variability in this process and requires the presence and expertise of a trained cytoologist.

To improve evaluation efficiency, a team of researchers at Helmholtz Zentrum München and the LMU University Hospital in Munich trained a deep network of neurons with about 20.000 single-cell images to classify them. The team, led by Dr. Carsten Marr and MD student Dr. Christian Matek from the Institute for Computational Biology at Helmholtz Zentrum München, and Prof. med Karsten Spiekermann and Simone Schwarz from the Third Department of the LMU University Hospital Munich, the images were obtained from 100 patients with invasive Blood smears were extracted from patients with hematologic disease AML and 100 controls. The new AI-driven approach is then evaluated by comparing its performance with the accuracy of human experts.

Deep learning algorithms for image processing require two things: first, a proper convolutional neural network architecture with hundreds of thousands of parameters; and second, a sufficiently large amount of training data. To date, there are no large digitized blood smear datasets, despite the common clinical use of these samples. The research group at Helmholtz Zentrum München has now provided the first large dataset of this type. Currently, Marr and his team are working closely with the Third Department of Medicine at the LMU Munich University Hospital and with the Munich Leukemia Laboratory (MLL), one of the largest European leukemia laboratories, to digitize hundreds of patient blood smears.

To bring our method to the clinic, digitization of patient blood samples has become routine. Algorithms must be trained using samples from different sources to cope with the inherent heterogeneity in sample preparation and staining. Together with our partners, we can demonstrate that deep learning algorithms show similar performance to human cytoologists. As a next step, we will evaluate how other disease characteristics, such as genetic mutations or translocations, can be predicted using this new AI-driven approach. “

The method demonstrates the application capabilities of AI in translation studies. This is an extension of Helmholtz Zentrum München’s pioneering work on single-cell classification of blood stem cells (Buggenthin et al., Nature Methods, 2017), which was awarded the Erwin Schroedinger Prize from the Helmholtz Society in 2018. Supported by SFB 1243 of the German Research Foundation (DFG) and a PhD scholarship to Dr. Christian Metek from the Jose Carreras Leukemia Foundation of Germany.

The Links:   NL6448BC26-01F G185XW01-V201

Robots will also help this epidemic prevention station – mecha warriors debut

 

The development of science and technology has allowed us to demonstrate unprecedented capabilities in the face of this epidemic. We saw the construction of Huoshenshan Hospital in 10 days, the application of drones and thermometers in epidemic prevention work, and even robots “target=”_blank”> wheeled robots began to assist medical staff in the hospital.

The development of online shopping has led to an increase in the number of logistics centers, and thus the number of wheeled robots that handle many heavy tasks in the logistics centers. Recently, we are seeing more and more human-friendly robots in banks, shopping malls, hotels, and supermarkets. No one expected that the next challenge that these wheeled robots had to deal with, the delivery of the last mile, came so unexpectedly.

The picture comes from the screenshot of CCTV

Under the initiative of less gatherings, less travel, no or less going to crowded places, and taking bus, subway, train flights, etc., wearing masks throughout the process. The significance of the existence of wheeled robots is highlighted. This is not a difficult job. They will soon deliver medicines, documents, takeaways, etc. to offices or wards.

Example of a wheeled robot delivering pizza

Wheeled Robot Application Portfolio

With the advent of wheeled robots that some consider “robots in disguise,” let’s take a look at the entire portfolio of robots currently in use in the industry:

Industrial robots (or robotic arms) handle tasks such as welding, palletizing, sorting, and lifting in factories. They are usually in fixed locations on the floor, ceiling or wall. They are controlled by controllers placed near the base or robotic arm.

While large industrial robots such as robotic arms have been in use for many years – mainly in the automotive industry – with growing opportunities for human-robot collaboration, smaller variants called cobots (collaborative robots) are entering the market significantly .

Accurate Obstacle Sensing in Overcrowded Logistics Centers Using TI’s mmWave or Time-of-Flight (TOF) Sensing Technology

Logistics robots can be used in warehouses, distribution centers, ports and even campuses. These robots can pick up goods and deliver them to packing stations, or robots can transport goods from one building to another. These robots move in a specific environment and require many sensors to locate and map, as well as sensors to avoid collisions.

Reception robots can be used in supermarkets, airports and hotels. These robots serve as virtual workers to welcome and guide customers/guests.

Inventory robots can be used in supermarkets or warehouses, scanning shelves on a regular basis, ensuring the store never runs out of products.

Example of a reception bot

Industrial robots are often located in “closed” environments, and for safety reasons, if a human enters the environment, the robot’s operation is stopped. But limiting human/robot collaboration prevents many benefits from being realized. Robots with autonomous operation can support the safe and efficient coexistence of humans and robots.

TI offers a complete reference design for wheeled robots

Sensing and intellisense for robotics applications are important because the efficient performance of robotic systems, especially machine learning applications, depends heavily on the performance of the sensors that provide critical data to these systems. Today’s vast array of increasingly sophisticated and accurate sensors, combined with systems that can fuse data from all of these sensors together, can support robots with better and better perception and awareness. Examples of sensors include: cameras, lidar, mmWave, and time-of-flight (ToF).

Sensing technology is especially important in vacuum robot operation. ToF sensors enable the robot to accurately map the operating environment and ensure that the robot completes tasks efficiently. Infrared cliff sensors prevent the robot from falling down stairs, or preventing steep descents.

Just as humans rely on senses and intelligence to accomplish tasks, a lot of technology is needed in robotics to simulate what humans take for granted. TI provides solutions that address many of these technology needs, including sensing, intelligence and power. Innovative simulation and embedded technologies help engineers develop smarter, more advanced robotic systems of the future. Click here to view the TI Industrial Robot Reference Design.

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Musk: SpaceX Starship will launch hundreds of satellite missions before manned flight

  

SpaceX is developing the next-generation “Starship” rocket, which it hopes will one day send dozens of people into space, but CEO Musk stressed that the rocket has many milestones before it can carry people.

“We’re going to get the rockets working first; autonomously transporting satellites and using them for hundreds of missions before sending people into space,” Musk said Monday at the virtual “Humans on Mars” conference.

Starship represents a top priority for the company, as Musk wants to build a fully reusable rocket system that can launch cargo or carry 100 people at a time.

While the company could land and reuse the rocket’s boosters, making SpaceX’s current Falcon fleet partially reusable, Musk wants Starship to transform space travel into a model more akin to commercial air travel.

The rocket’s sheer size will also allow it to launch several times as much cargo at a time – for comparison, SpaceX’s Falcon 9 rocket can send up to 60 Starlink satellites at a time, while SpaceX says Starship is capable of launching 400 Starlink satellites at a time satellite.

The company quickly established a factory in Texas and has already conducted short-term flight tests of an early Starship prototype.

But over the past year, early Starship development plans have suffered several explosive setbacks. But Musk has shifted the company’s focus to Starship, saying in June that progress on the rocket must “immediately accelerate significantly.”

Three months later, Musk’s sense of urgency appears to be paying off.

“We’re making good progress,” Musk said. “What’s really holding back Starship is the production system… A year ago there was nothing there, and now we’ve got quite a bit of production capacity. So we’re making more and more ships rapidly.”

When Musk unveiled the Starship prototype in September 2019, he hoped that SpaceX would be able to put the rocket into orbit by March this year, and even launch a crew in 2020.

But his tone has shifted since then, as he warned Monday that the first Starship launches to orbit “may not be successful,” saying SpaceX was in “uncharted territory.” He now doesn’t expect Starship’s first orbital flight test to arrive until next year.

“No one has ever built a fully reusable orbital rocket,” Musk said.

He also said that SpaceX has not done much work on the design of Starship’s cabin or interior passengers. Notably, Musk emphasized that SpaceX has experience building “complex life support systems capable of handling a variety of environments” and the company’s Crew Dragon capsule successfully carried a pair of NASA astronauts back and forth on a mission this summer International Space Station.

Work at the Texas factory is continuing toward the next flight test of Starship, and Musk said the company will begin building the first Super Heavy booster prototype “this week.” The super heavy rocket is the large lower half of the entire rocket, and it has most of the engines, which are used at the beginning of the launch.

SpaceX has continued to raise private funding for its projects, most recently seeking an equity investment of nearly $2.1 billion. According to reports, SpaceX’s total equity fundraising over the past two years is about $3.75 billion, and its valuation has climbed to $46 billion.

In the near future, SpaceX plans to fly Starship to low Earth orbit, and then to the moon. But Mars remains Musk’s long-term goal. “The company will get to the Red Planet “given enough time,” Musk said, but “the question is: how long will it take us?”

“And getting to Mars, I don’t think it’s the fundamental issue. The fundamental issue is building a base on Mars, building a self-sufficient city,” Musk said. “We’re going to build a propellant factory, an initial Mars base — Mars Base Alpha — and then make it self-sufficient.”

“I want to stress that this is a very hard, dangerous, difficult thing, not for the faint of heart,” he added. “There’s a good chance you’ll die, it’ll be tough, but if it’s successful, it’ll be glorious.”

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